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DAC8043
Rev. E | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
V
DD to GND
0.3 V to +8 V
V
REF to GND
±18 V
V
RFB to GND
±18 V
Digital Input Voltage Range
0.3 V to V
DD + 0.3 V
V
IOUT to GND
0.3 V to V
DD + 0.3 V
Operating Temperature Range
FP Version
40°C to +85°C
GP Version
0°C to 70°C
Junction Temperature
150°C
Storage Temperature
65°C to +150°C
Lead Temperature (Soldering, 60 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
CAUTION
1. Do not apply voltages higher than VDD or less than GND
potential on any terminal except VREF and RFB.
2. The digital control inputs are Zener-protected; however,
permanent damage may occur on unprotected units from
high energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Use proper antistatic handling procedures.
4. Absolute Maximum Ratings apply to both packaged devices
and dice. Stresses above those listed under the Absolute
Maximum Ratings may cause permanent damage to the
device.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
8-Lead PDIP
96
37
°C/W
16-Lead SOIC
92
27
°C/W
ESD CAUTION
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